Company Filing History:
Years Active: 2009-2012
Title: Kiangkai Tankongchumruskul: Innovator in Electronic Component Encapsulation
Introduction
Kiangkai Tankongchumruskul is a notable inventor based in Balmain, Australia. He has made significant contributions to the field of electronic components, particularly in the area of encapsulation methods. With a total of 16 patents to his name, his work has advanced the technology used in electronic devices.
Latest Patents
One of his latest patents is the "Wire bond encapsulant control method." This method describes a technique for depositing encapsulant on a line of wire bonds to a die. The die has a back surface in contact with a support structure and an active surface that opposes it. The method involves positioning a barrier between the contact pads and functional elements, allowing for precise control over the encapsulant application. This innovation reduces flow variations and enhances the encapsulant front's correspondence to the barrier's shape.
Another significant patent is the "Electronic component with wire bonds in low modulus fill encapsulant." This invention features an electronic component that includes a support structure with multiple electrical conductors and a series of wire bonds. The encapsulation method described ensures that the dam encapsulant has a higher modulus of elasticity than the fill encapsulant, providing improved performance and reliability.
Career Highlights
Kiangkai has worked with several companies throughout his career, including Silverbrook Research Pty Ltd and Zamtec Limited. His experience in these organizations has contributed to his expertise in electronic component design and encapsulation techniques.
Collaborations
He has collaborated with notable individuals in the field, including Laval Chung-Long-Shan and Kia Silverbrook. These partnerships have further enriched his work and innovations in electronic components.
Conclusion
Kiangkai Tankongchumruskul is a distinguished inventor whose contributions to electronic component encapsulation have made a lasting impact on the industry. His innovative methods and collaborative efforts continue to shape the future of electronic technology.