The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2011

Filed:

Jun. 10, 2010
Applicants:

Kia Silverbrook, Balmain, AU;

Laval Chung-long-shan, Balmain, AU;

Kiangkai Tankongchumruskul, Balmain, AU;

Inventors:

Kia Silverbrook, Balmain, AU;

Laval Chung-Long-Shan, Balmain, AU;

Kiangkai Tankongchumruskul, Balmain, AU;

Assignee:

Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.


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