Company Filing History:
Years Active: 2009-2012
Title: The Innovative Mind of Laval Chung-Long-Shan
Introduction
Laval Chung-Long-Shan is an esteemed inventor based in Balmain, Australia, recognized for his significant contributions to the field of electronics and encapsulation technology. With an impressive portfolio of 15 patents, his work illustrates a profound understanding of electronic components and innovative methodologies.
Latest Patents
Among his most recent innovations is the "Wire Bond Encapsulant Control Method." This method describes an intricate approach to depositing encapsulant on wire bonds connected to a die. The process involves positioning a barrier to control the flow of encapsulant, ensuring that it adheres precisely to the electrical contact pads without affecting the functional elements of the die. This innovation not only improves efficiency but also enhances the reliability of encapsulated electronic components.
Another notable patent is the "Electronic Component with Wire Bonds in Low Modulus Fill Encapsulant." This invention details a design of an electronic component featuring multiple electrical conductors and wire bonds. The encapsulation utilizes a two-layer approach, with a dam encapsulant of higher modulus distinct from the low-modulus fill encapsulant. The dual encapsulation format aims to optimize performance and safeguard the integrity of electronic connections.
Career Highlights
Laval has worked with prominent organizations such as Silverbrook Research Pty Ltd and Zamtec Limited. His experience in these companies reflects his dedication to advancing encapsulation techniques and electronic component technologies.
Collaborations
In his journey as an inventor, Laval has collaborated with talented colleagues, including Kiangkai Tankongchumruskul and Kia Silverbrook. These partnerships have contributed to the creative process, enabling the exchange of ideas and fostering innovation.
Conclusion
Laval Chung-Long-Shan continues to make waves in the field of electronic innovation through his inventive spirit and technical expertise. His patents not only push the boundaries of technology but also hold the potential to redefine standards in the industry. As he progresses, the impact of his work will undoubtedly resonate throughout the field of electronics and encapsulation.