The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2011

Filed:

Feb. 03, 2009
Applicants:

Susan Williams, Balmain, AU;

Laval Chung-long-shan, Balmain, AU;

Kiangkai Tankongchumruskul, Balmain, AU;

Inventors:

Susan Williams, Balmain, AU;

Laval Chung-Long-Shan, Balmain, AU;

Kiangkai Tankongchumruskul, Balmain, AU;

Assignee:

Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.


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