The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Sep. 25, 2007
Laval Chung-long-shan, Balmain, AU;
Kiangkai Tankongchumruskul, Balmain, AU;
Kia Silverbrook, Balmain, AU;
Laval Chung-Long-Shan, Balmain, AU;
Kiangkai Tankongchumruskul, Balmain, AU;
Kia Silverbrook, Balmain, AU;
Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;
Abstract
A method of profiling a wire bond between a contact pad on a die, and a conductor on a supporting structure, by electrically connecting the contact pad on the die to the conductor on the supporting structure with a wire bond, the wire bond extending in an arc from the contact pad to the conductor, pushing on the wire bond to collapse the arc and plastically deform the wire bond, and then releasing the wire bonds such that the plastic deformation maintains the wire bond in a flatter profile shape. The strength of the wire bond is known to be relatively small; of the order of 3 to 5 grams force. However, the Applicant's work has found that the wire bond structure is robust enough to withstand a certain degree of work hardening from plastic deformation. The arc of the wire bond can be deformed into a flatter profile without compromising the electrical connection with the PCB.