The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Feb. 03, 2009
Nadine Lee-yen Chew, Balmain, AU;
Elmer Dimaculangan Perez, Balmain, AU;
Kiangkai Tankongchumruskul, Balmain, AU;
Nadine Lee-Yen Chew, Balmain, AU;
Elmer Dimaculangan Perez, Balmain, AU;
Kiangkai Tankongchumruskul, Balmain, AU;
Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;
Abstract
A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.