Company Filing History:

9 out of 10,938

Skhynix Inc.

Global Standard Technology Co., Ltd.

patents

5. 1 out of 6,228

Hynix Semiconductor Inc.

patents

Years Active: 2013-2024

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11955435 - Semiconductor packages (2024-04-09),

2. 11018094 - Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packages (2021-05-25),

3. 10002851 - Semiconductor packages including chip enablement pads (2018-06-19),

4. 9956525 - Apparatus for purifying waste gases for integrated semiconductor (2018-05-01),

5. 9875990 - Semiconductor package including planar stacked semiconductor chips (2018-01-23),

6. 9576849 - Semiconductor package and method for manufacturing the same (2017-02-21),

7. 9502378 - Printed circuit boards having blind vias, method of testing electric current flowing through blind via thereof and method of manufacturing semiconductor packages including the same (2016-11-22),

8. 9455230 - Semiconductor packages and methods of fabricating the same (2016-09-27),

9. 9282626 - Printed circuit board and method for manufacturing the same (2016-03-08),

10. 9208827 - Semiconductor stacked package (2015-12-08),

11. 9070570 - Stack packages having token ring loops (2015-06-30),

12. 8907383 - Stack packages having token ring loops (2014-12-09),

13. 8383461 - Method for manufacturing semiconductor package having improved bump structures (2013-02-26),

Title: The Innovations of Ki Yong Lee

Introduction

Ki Yong Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.

Latest Patents

Among his latest patents, Ki Yong Lee has developed innovative semiconductor packages that include a semiconductor die and an encapsulant layer. A unique mark is formed on the surface of the encapsulant layer, while a damage barrier layer is strategically placed between the mark and the semiconductor die. This barrier effectively blocks the propagation of laser light used to create the mark from reaching the semiconductor die. Additionally, he has patented methods for measuring contact resistances in semiconductor packages. This method involves a package substrate with a semiconductor chip mounted on it, surrounded by a molding member and an electromagnetic interference (EMI) shielding layer. The design includes multiple interconnection patterns that enhance the functionality of the semiconductor package.

Career Highlights

Ki Yong Lee has worked with notable companies in the semiconductor industry, including SK Hynix Inc. and LG Innotek Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Ki Yong Lee has collaborated with talented individuals such as Jong Hyun Kim and Hyung Ju Choi. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Ki Yong Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative approaches continue to shape the future of semiconductor packaging and performance.

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