The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Oct. 08, 2015
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Yeon Ji Park, Icheon-si, KR;
Hyeon Ji Baek, Seoul, KR;
Ki Yong Lee, Seoul, KR;
Jong Hyun Kim, Seoul, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/296 (2013.01); H01L 23/3114 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01);
Abstract
A semiconductor package includes a semiconductor chip electrically connected to a substrate, and a molding part including first molding members and second molding members arranged in an alternating pattern. The first molding members have a first physical flexibility which is different from a second physical flexibility of the second molding members.
Park, Yeon. (2016). Semiconductor packages and methods of fabricating the same (U.S. Patent No. 9455230). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9455230
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile