Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packages

Abstract

A method of obtaining contact resistance values of a semiconductor package, the semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, a molding member disposed on the package substrate to surround the semiconductor chip, and an electromagnetic interference (EMI) shielding layer disposed on side surfaces of the package substrate and on the molding member. The package substrate includes a substrate body having a first surface and a second surface which are opposite to each other, first to fourth upper interconnection patterns disposed on the first surface of the substrate body in a first region of the package substrate and in contact with the EMI shielding layer, and an interconnection structure disposed in a second region of the package substrate.