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For the Inventor, By the Inventor

Uiwang, South Korea

Ki Tae Song

This inventor holds 5 USPTO granted patents and 6 published patent applications. Top assignee: Cheil Industries Inc.. Active years: 2013-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ki Tae Song. Retrieved from https://idiyas.com/inventor/ki-tae-song

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 60.0

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:

goldMedal5 out of 787 
 
Cheil Industries Inc.
 patents

Years Active: 2013-2015

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5 patents (USPTO):Explore Patents
1. 9109147 - Adhesive composition for semiconductor and adhesive film comprising the same (2015-08-18),
2. 8946343 - Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film (2015-02-03),
3. 8623512 - Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film (2014-01-07),
4. 8609515 - Dicing die bonding film, semiconductor wafer, and semiconductor device (2013-12-17),
5. 8557896 - Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film (2013-10-15),

Title: The Innovations of Ki Tae Song

Introduction

Ki Tae Song is a prominent inventor based in Uiwang-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on adhesive compositions that enhance the performance and reliability of semiconductor devices.

Latest Patents

Among his latest patents, Ki Tae Song has developed an adhesive composition for semiconductors that features two exothermic peaks between 65°C and 350°C. This innovative adhesive composition has an area ratio of voids of less than 10%, which is measured after curing at 150°C for 10 minutes and then at 150°C for 30 minutes, followed by molding at 175°C for 60 seconds. The first exothermic peak appears between 65°C and 185°C, while the second exothermic peak occurs between 155°C and 350°C. Another notable patent includes an adhesive film prepared using the same adhesive composition, which exhibits a curing rate of about 70% to 100% in the first exothermic peak zone.

Career Highlights

Ki Tae Song is currently employed at Cheil Industries Inc., where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing adhesive materials that are crucial for the manufacturing of high-performance semiconductor devices.

Collaborations

Some of his notable coworkers include Ah Ram Pyun and Baek Soung Park, who have collaborated with him on various projects within the company.

Conclusion

Ki Tae Song's contributions to adhesive compositions for semiconductors highlight his expertise and commitment to innovation in the technology sector. His patents reflect a deep understanding of material science and its applications in modern electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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