The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2014

Filed:

Dec. 16, 2010
Applicants:

Ah Ram Pyun, Uiwang-si, KR;

Jae Hyun Cho, Uiwang-si, KR;

Ki Tae Song, Uiwang-si, KR;

Inventors:

Ah Ram Pyun, Uiwang-si, KR;

Jae Hyun Cho, Uiwang-si, KR;

Ki Tae Song, Uiwang-si, KR;

Assignee:

Cheil Industries, Inc., Gumi-si, Kyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); C08G 59/62 (2006.01); C09J 163/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.


Find Patent Forward Citations

Pyun, Ah. (2014). Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film (U.S. Patent No. 8623512). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8623512

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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