The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Jun. 24, 2013
Applicants:
Baek Soung Park, Uiwang-si, KR;
Ki Tae Song, Uiwang-si, KR;
Dong Seon Uh, Uiwang-si, KR;
IN Hwan Kim, Uiwang-si, KR;
Inventors:
Baek Soung Park, Uiwang-si, KR;
Ki Tae Song, Uiwang-si, KR;
Dong Seon Uh, Uiwang-si, KR;
In Hwan Kim, Uiwang-si, KR;
Assignee:
CHEIL INDUSTRIES, INC., Gumi-si, Kyeongsangbuk-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); H01L 23/00 (2006.01); C09J 7/00 (2006.01); C08L 63/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C09J 7/00 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); C08L 63/00 (2013.01); H01L 24/27 (2013.01); H01L 24/48 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92165 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06506 (2013.01); H01L 2924/00014 (2013.01);
Abstract
An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C.