The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8557896 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 15, 2013

Filed:

Dec. 27, 2010
Applicants:

Chul Jeong, Uiwang-si, KR;

Ki Tae Song, Uiwang-si, KR;

Han Nim Choi, Uiwang-si, KR;

Su MI Im, Uiwang-si, KR;

Ah Ram Pyun, Uiwang-si, KR;

Sang Jin Kim, Uiwang-si, KR;

Inventors:

Chul Jeong, Uiwang-si, KR;

Ki Tae Song, Uiwang-si, KR;

Han Nim Choi, Uiwang-si, KR;

Su Mi Im, Uiwang-si, KR;

Ah Ram Pyun, Uiwang-si, KR;

Sang Jin Kim, Uiwang-si, KR;

Assignee:

Cheil Industries, Inc., Gumi-si, Kyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.


Find Patent Forward Citations

Jeong, Chul. (2013). Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film (U.S. Patent No. 8557896). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8557896

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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