Ki-Hyeon Kim

Title: Innovations of Ki-Hyeon Kim in Copper Electroplating

Introduction

Ki-Hyeon Kim is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of electroplating, particularly in copper electroplating solutions and methods. With a total of 2 patents, his work has advanced the technology used in various applications.

Latest Patents

Ki-Hyeon Kim's latest patents include a copper electroplating solution and a copper electroplating apparatus. The electroplating solution comprises an aqueous electrolyte solution that includes water-soluble copper salts, sulfide ions, and chloride ions. It also features an accelerator made from an organic material containing sulfur, which enhances the reduction of copper. Additionally, a suppressor made from a polyether compound selectively suppresses copper reduction, while a leveler includes a water-soluble polymer with nitrogen that dissolves into positive ions in the aqueous electrolyte solution. His copper electroplating method involves dipping a substrate with a seed layer into the copper electroplating solution, which contains water, a copper supply source, an electrolytic material, and a first additive represented by a specific formula.

Career Highlights

Throughout his career, Ki-Hyeon Kim has worked with prominent companies such as Samsung Electronics and Adeka Corporation. His experience in these organizations has allowed him to refine his expertise in electroplating technologies.

Collaborations

Ki-Hyeon Kim has collaborated with notable coworkers, including Myung-Beom Park and Jung-sik Choi. Their joint efforts have contributed to the advancements in the field of electroplating.

Conclusion

Ki-Hyeon Kim's innovations in copper electroplating have made a significant impact on the industry. His patents reflect a deep understanding of electroplating solutions and methods, showcasing his role as a leading inventor in this field.