The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Jan. 15, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Myung-Beom Park, Hwaseong-si, KR;

Yun-Deok Kang, Hwaseong-si, KR;

Ki-Hyeon Kim, Seoul, KR;

Youn-Joung Cho, Hwaseong-si, KR;

Jung-Sik Choi, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 3/38 (2006.01); C25D 5/04 (2006.01); C25D 5/08 (2006.01); C25D 17/00 (2006.01); C25D 17/06 (2006.01); C25D 21/14 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 5/04 (2013.01); C25D 5/08 (2013.01); C25D 17/001 (2013.01); C25D 17/06 (2013.01); C25D 21/14 (2013.01);
Abstract

An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.


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