The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Nov. 07, 2011
Myung-beom Park, Hwaseong-si, KR;
Jung-sik Choi, Seongnam-si, KR;
Ki-hyeon Kim, Seoul, KR;
Yuji Morishima, Tokyo, JP;
Shin-ichi Tanaka, Tokyo, JP;
Takashi Yamada, Tokyo, JP;
Takehiro Zushi, Tokyo, JP;
Myung-Beom Park, Hwaseong-si, KR;
Jung-Sik Choi, Seongnam-si, KR;
Ki-Hyeon Kim, Seoul, KR;
Yuji Morishima, Tokyo, JP;
Shin-ichi Tanaka, Tokyo, JP;
Takashi Yamada, Tokyo, JP;
Takehiro Zushi, Tokyo, JP;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Adeka Corporation, Tokyo, JP;
Abstract
A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below: