Samsung Electronics Co., Ltd.

Adeka Corporation

Ki-Hyeon Kim

Jung-sik Choi

Myung-Beom Park

Takashi Yamada

Youn-Joung Cho

Shin-ichi Tanaka

Takehiro Zushi

Yun-Deok Kang

Yuji Morishima

An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.

Copper electroplating solution and copper electroplating apparatus

A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below: 

Copper electroplating method

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Seoul, South Korea

Ki-Hyeon Kim