IDiyas

For the Inventor, By the Inventor

San Jose, CA, United States of America

Kevin J Haley

USPTO Granted Patents = 19

Average Co-Inventor Count = 1.8

ph-index = 13

Forward Citations = 539(Granted Patents)


Company Filing History:

goldMedal19 out of 54,688 
 
Intel Corporation
 patents

Years Active: 1991-2006

Loading Chart...
19 patents (USPTO):Explore Patents
1. 7132313 - Diamond heat spreading and cooling technique for integrated circuits (2006-11-07),
2. 6667548 - Diamond heat spreading and cooling technique for integrated circuits (2003-12-23),
3. 6404047 - Socketable BGA package (2002-06-11),
4. 6313987 - Thermal connector for joining mobile electronic devices to docking stations (2001-11-06),
5. 6181555 - Cooling system for integrated circuit chips in a portable computer (2001-01-30),
6. 6168976 - Socketable BGA package (2001-01-02),
7. 6043560 - Thermal interface thickness control for a microprocessor (2000-03-28),
8. 5982617 - Cooling system for integrated circuit chips in a portable computer lid (1999-11-09),
9. 5966286 - Cooling system for thin profile electronic and computer devices (1999-10-12),
10. 5956229 - Injection molded thermal interface system (1999-09-21),
11. 5718282 - Heat pipe exchanger system for cooling a hinged computing device (1998-02-17),
12. 5646822 - Heat pipe exchanger system for cooling a hinged computing device (1997-07-08),
13. 5621613 - Apparatus for dissipating heat in a hinged computing device (1997-04-15),
14. 5531021 - Method of making solder shape array package (1996-07-02),
15. 5506756 - Tape BGA package die-up/die down (1996-04-09),

Title: Kevin J Haley: Innovator in Semiconductor Technology

Introduction

Kevin J Haley, an accomplished inventor based in San Jose, CA, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 19 patents, Haley's innovations have propelled advancements in the efficiency and performance of integrated circuits.

Latest Patents

Haley's latest patent focuses on a groundbreaking "Diamond heat spreading and cooling technique for integrated circuits." This innovation features a semiconductor chip with an integral heat spreading layer that enhances heat transmission from the die to the ambient environment. The design strategically spreads heat over a larger cross-sectional area on the die, minimizing local hot spots. This allows the semiconductor chip to operate at higher frequencies while adhering to established upper threshold temperatures. Additionally, the patent outlines a manufacturing method for this semiconductor chip, along with a cooling technique tailored for optimal performance.

Career Highlights

Kevin J Haley is currently associated with Intel Corporation, a leading technology company renowned for its innovations in microprocessors and semiconductor solutions. Over the years, Haley has demonstrated exceptional ingenuity and has established himself as a key contributor to advancing semiconductor performance through innovative designs and technologies.

Collaborations

Throughout his career, Haley has collaborated with esteemed colleagues such as Michael Francis O'Connor and Rakesh Bhatia, working together to explore new possibilities and drive advancements in semiconductor technology. Such collaborations reflect the collaborative spirit of innovation that is essential in the high-tech industry.

Conclusion

Kevin J Haley stands out as a significant figure in the realm of semiconductor innovations. His extensive patent portfolio, particularly his advancements in heat spreading and cooling techniques for integrated circuits, showcases his commitment to enhancing technology. As he continues to push the boundaries of semiconductor performance at Intel Corporation, there is no doubt that Haley's contributions will have a lasting impact on the industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…