The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 1996
Filed:
Dec. 30, 1994
Frank Kolman, Phoenix, AZ (US);
Kevin Haley, San Jose, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A surface mount package for an electronic device has an array of solder shapes or structures projecting from the bottom surface of the package. The solder structures are cast in place on the package substrate using a wave solder process. The solder also fills via holes in the substrate at each solder structure site. An integrated circuit is bonded to the top surface of the substrate using a conventional tape automated bonding (TAB) process or other suitable bonding process. The preferred shape of the solder structure is a cone, but other shapes, including hemispheres, columns and pyramids can be produced using a mold with suitably shaped cavities. The mold is preferably as large as an entire substrate panel so that a large number of device sites can be processed simultaneously.