Frank Kolman

Title: Frank Kolman: Innovator in Integrated Circuit Packaging

Introduction

Frank Kolman is a notable inventor based in Phoenix, AZ (US), recognized for his contributions to the field of integrated circuit packaging. With a total of 5 patents to his name, Kolman has made significant advancements that enhance the performance and reliability of electronic devices.

Latest Patents

Among his latest innovations are two key patents. The first is for a "Thermal grease insertion and retention" system, which features an integrated circuit package that includes an integrated circuit mounted to a substrate. This package is designed with a cover plate that is separated from the integrated circuit by a small space, allowing thermal grease to be injected through ports in the cover plate. This innovative design ensures that the thermal grease is confined to an area immediately adjacent to the integrated circuit, optimizing heat dissipation.

The second patent is for a "Heat pipe to baseplate attachment method." This integrated circuit package incorporates a heat pipe within its body, providing a direct thermal path between the integrated circuit die and the heat pipe. The heat pipe is securely attached to a nut that is screwed into the cover plate, enhancing the thermal management of the device.

Career Highlights

Frank Kolman is currently employed at Intel Corporation, where he continues to push the boundaries of technology in integrated circuit design. His work has been instrumental in developing solutions that address the challenges of heat management in electronic devices.

Collaborations

Throughout his career, Kolman has collaborated with talented individuals such as Michael P Brownell and Hong Xie, contributing to a dynamic and innovative work environment.

Conclusion

Frank Kolman's contributions to integrated circuit packaging have significantly impacted the electronics industry. His innovative patents demonstrate his commitment to advancing technology and improving device performance.