The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 1999
Filed:
Apr. 01, 1998
Applicant:
Inventors:
Michael Brownell, Los Gatos, CA (US);
Dan McCutchan, Redwood City, CA (US);
Hong Xie, Chandler, AZ (US);
Kevin Haley, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361699 ; 361700 ; 361704 ; 361719 ; 257714 ; 257715 ; 174 152 ; 165 804 ; 29890032 ;
Abstract
A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled to the circuit board, the heatpipe is thermally coupled to the integrated circuit package. The plastic mold is lightweight and relatively inexpensive to produce. The mold also provides enough structural rigidity to prevent warping of the heatpipe.