Suzhou, China

Keunhyuk Lee

This inventor holds 26 USPTO granted patents and 23 published patent applications, primarily in Power Module Packaging. Top assignee: Semiconductor Components Industries, LLC. Active years: 2020-2026.

USPTO Granted Patents = 26 

% Patents Active = 88.5

Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Jiangsu, CN (2021)
  • Suzhou, CN (2020 - 2024)

Company Filing History:


Years Active: 2020-2026

Loading Chart...
Areas of Expertise:
Power Module
Semiconductor Package
Flexible Clip
Dual Cooling
Conductive-Bonding
Leadframe
High Power Module
Stacked Substrates
Solderless Pins
Direct Bonded Metal
Isolated 3D Device
Stress Buffer Layer
26 patents (USPTO):Explore Patents

Title: **Keunhyuk Lee: Innovative Mind in Semiconductor Technology**

Introduction

Keunhyuk Lee has made significant contributions to the field of semiconductor technology from Suzhou, China. With an impressive portfolio of 19 patents, Lee demonstrates a commitment to innovation that has paved the way for advanced semiconductor applications.

Latest Patents

Two of his most recent patents showcase his pioneering skills and creativity in enhancing semiconductor design. The first patent, titled "Module with Substrate Recess for Conductive-Bonding Component," introduces a method of forming a recess and mesa in a metal layer associated with a substrate. This innovative technique involves disposing a first portion of a conductive-bonding component on the mesa and a second portion in the recess, facilitating the secure attachment of a semiconductor component.

The second patent, "Dual Cool Power Module with Stress Buffer Layer," outlines a method for wireless, surface mounting of at least two semiconductor dies on die attach pads (DAPs) of a semiconductor package. Here, the semiconductor dies are electrically connected by a clip, which is enhanced by a stress buffer layer for improved durability. A heatsink is provided on the stress buffer layer, ensuring efficient thermal management.

Career Highlights

Keunhyuk Lee currently works at Semiconductor Components Industries, LLC, where he collaborates with a talented team to drive innovation in semiconductor technologies. His expertise in developing advanced semiconductor components and systems has positioned him as a key player in the industry.

Collaborations

Lee has worked alongside notable colleagues such as Tiburcio Maldo and Jie Chang. Together, they facilitate a dynamic exchange of ideas, leading to impactful innovations that continue to influence the semiconductor landscape.

Conclusion

With a robust portfolio and a collaborative spirit, Keunhyuk Lee is a celebrated inventor in the semiconductor field. His contributions not only highlight his technical prowess but also reflect a broader commitment to advancing technology for a better future. The innovations stemming from his work will undoubtedly lead to new possibilities in semiconductor applications and beyond.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…