Hwaseong-si, South Korea

Keung Beum Kim

USPTO Granted Patents = 14 

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2014-2025

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14 patents (USPTO):Explore Patents

Title: Innovations of Keung Beum Kim in Semiconductor Technology

Introduction

Keung Beum Kim is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on enhancing semiconductor packaging, which is crucial for the performance and efficiency of electronic devices.

Latest Patents

One of his latest patents involves a semiconductor package that includes a first semiconductor chip with a logic structure and a second semiconductor chip bonded to it. This innovative design features signal lines on the first surface of the first semiconductor substrate, a power delivery network on the opposite surface, and penetration vias that connect these components. Another notable patent describes a semiconductor package that consists of a redistribution substrate and a semiconductor chip. This design incorporates ground under-bump patterns and signal under-bump patterns, ensuring effective signal transmission and power distribution.

Career Highlights

Keung Beum Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His expertise and innovative approach have positioned him as a key player in the industry, contributing to advancements that enhance the functionality of electronic devices.

Collaborations

Throughout his career, Kim has collaborated with talented individuals such as Seung-Yong Cha and Yonghoon Kim. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Keung Beum Kim's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of electronics, making significant strides in enhancing device performance.

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