logo

For the Inventor, By the Inventor

Bucheon, South Korea

Keun-hyuk Lee

This inventor holds 16 USPTO granted patents and 1 published patent application. Top assignee: Fairchild Korea Semiconductor Ltd.. Active years: 2004-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keun-hyuk Lee. Retrieved from https://idiyas.com/inventor/keun-hyuk-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 93.8

Average Co-Inventor Count = 1.9

ph-index = 6

Forward Citations = 121(Granted Patents)


Location History:

  • Seoul, KR (2004)
  • Bucheon-Gyeonggi-do, KR (2012)
  • Bucheon-si, KR (2010 - 2013)
  • Gyeonggi-do, KR (2012 - 2015)

Company Filing History:

goldMedal16 out of 354 
 
Fairchild Korea Semiconductor Ltd.
 patents

Years Active: 2004-2015

Loading Chart...
16 patents (USPTO):Explore Patents
1. 9130065 - Power module having stacked flip-chip and method for fabricating the power module (2015-09-08),
2. 8350369 - High power semiconductor package (2013-01-08),
3. 8258622 - Power device package and semiconductor package mold for fabricating the same (2012-09-04),
4. 8125080 - Semiconductor power module packages with simplified structure and methods of fabricating the same (2012-02-28),
5. 8013431 - Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same (2011-09-06),
6. 7986531 - Power system module and method of fabricating the same (2011-07-26),
7. 7951645 - Power module for low thermal resistance and method of fabricating the same (2011-05-31),
8. 7871848 - Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same (2011-01-18),
9. 7842545 - Semiconductor package having insulated metal substrate and method of fabricating the same (2010-11-30),
10. 7808103 - Leadless package (2010-10-05),
11. 7714428 - High power semiconductor package and method of making the same (2010-05-11),
12. 7706146 - Power system module and method of fabricating the same (2010-04-27),
13. 7701048 - Power module for low thermal resistance and method of fabricating the same (2010-04-20),
14. 7675148 - Power module having stacked flip-chip and method of fabricating the power module (2010-03-09),
15. 7659559 - Semiconductor package having insulated metal substrate and method of fabricating the same (2010-02-09),

Title: The Innovative Journey of Keun-hyuk Lee

Introduction: Keun-hyuk Lee, a talented inventor hailing from Bucheon-si, South Korea, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Keun-hyuk Lee's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology for energy efficiency, and wearable health monitoring devices.

Career Highlights: With a career spanning over two decades, Keun-hyuk Lee has worked with top tech companies in South Korea, leading research teams and spearheading projects that have resulted in multiple successful patent applications.

Collaborations: Throughout his career, Keun-hyuk Lee has collaborated with renowned researchers from universities and research institutions worldwide, fostering a culture of innovation and knowledge sharing.

Conclusion: Keun-hyuk Lee's passion for innovation and his relentless drive to push the boundaries of technology make him a true pioneer in the field of inventions. His contributions continue to shape the future of technology and inspire the next generation of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…