The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Jan. 04, 2008
Keun-hyuk Lee, Bucheon-si, KR;
Seung-won Lim, Bucheon-si, KR;
Sung-min Park, Bucheon-si, KR;
Taek-keun Lee, Bucheon-si, KR;
Keun-hyuk Lee, Bucheon-si, KR;
Seung-won Lim, Bucheon-si, KR;
Sung-min Park, Bucheon-si, KR;
Taek-keun Lee, Bucheon-si, KR;
Fairchild Korea Semiconductor, Ltd., Bucheon-si, KR;
Abstract
Provided is a high power semiconductor package including: an insulation substrate having first and second surfaces opposite to each other; an interconnection patterns formed on the first surface of the insulation substrate, the interconnection patterns including a plurality of first dimples; a power control semiconductor chip mounted on the first surface of the insulation substrate, the power control semiconductor chip electrically connected with the interconnection patterns; and an encapsulation member encapsulating the insulation substrate, the interconnection patterns, and the power control semiconductor chip and exposing at least a portion of the second surface of the insulation substrate.