Taek-keun Lee

Title: Taek-keun Lee: Innovator in Power Device Packaging

Introduction

Taek-keun Lee is a prominent inventor based in Bucheon-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in power device packaging. With a total of 3 patents to his name, Lee's work has had a substantial impact on the efficiency and reliability of power devices.

Latest Patents

One of Lee's latest patents is titled "Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package." This innovation features a metal tab die attach paddle that is strategically placed between the lead frame and a power device die. This design effectively reduces the stress exerted on the semiconductor power device die, which is caused by the differing coefficients of thermal expansion (CTE) of the materials involved. Additionally, this power device package significantly prevents impurities from penetrating by increasing the surface creepage distance of a sealant, thanks to the metal tab DAP and an optional swaging of the lead frame.

Another notable patent is the "High power semiconductor package." This invention includes an insulation substrate with first and second surfaces that are opposite to each other. The first surface features interconnection patterns that include a plurality of first dimples. A power control semiconductor chip is mounted on this surface and is electrically connected to the interconnection patterns. The entire assembly is encapsulated by a member that protects the insulation substrate, interconnection patterns, and power control semiconductor chip while exposing part of the second surface of the insulation substrate.

Career Highlights

Taek-keun Lee is currently employed at Fairchild Korea Semiconductor Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in power devices, making them more efficient and reliable.

Collaborations

Lee collaborates with talented coworkers, including Joon-seo Son and O-seob Jeon. Their combined expertise contributes to the innovative environment at Fairchild Korea Semiconductor Ltd.

Conclusion

Taek-keun Lee is a distinguished inventor whose contributions to power device packaging have made a significant impact on the semiconductor industry. His innovative patents reflect his commitment to enhancing the performance and reliability of power devices.