The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Jan. 08, 2008
Joon-seo Son, Seoul, KR;
O-seob Jeon, Seoul, KR;
Taek-keun Lee, Bucheon-si, KR;
Byoung-ok Lee, Bucheon-si, KR;
Joon-Seo Son, Seoul, KR;
O-seob Jeon, Seoul, KR;
Taek-keun Lee, Bucheon-si, KR;
Byoung-ok Lee, Bucheon-si, KR;
Fairchild Korea Semiconductor Ltd., Bucheon-si, KR;
Abstract
A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.