Bucheon-si, South Korea

Byoung-ok Lee


Average Co-Inventor Count = 5.3

ph-index = 3

Forward Citations = 115(Granted Patents)


Location History:

  • Kyungki-do, KR (2006 - 2007)
  • Gyeonggi-do, KR (2013)
  • Bucheon-si, KR (2011 - 2015)

Company Filing History:


Years Active: 2006-2015

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5 patents (USPTO):Explore Patents

Title: Byoung-ok Lee: Innovator in Power Device Packaging

Introduction

Byoung-ok Lee is a prominent inventor based in Bucheon-si, South Korea. He has made significant contributions to the field of power device packaging, holding a total of 5 patents. His innovative designs focus on improving the reliability and efficiency of power devices.

Latest Patents

One of his latest patents is titled "Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package." This invention features a metal tab die attach paddle that is strategically placed between the lead frame and a power device die. This design reduces the stress on the semiconductor power device die caused by differing coefficients of thermal expansion. Additionally, it effectively prevents impurities from entering the package by increasing the surface creepage distance of the sealant.

Another notable patent is "Power device packages having thermal electric modules using Peltier effect and methods of fabricating the same." This invention includes thermal electric modules that utilize the Peltier effect to enhance operational reliability. By rapidly dissipating heat generated during operation, these power device packages improve overall performance. The design incorporates a thermal electric module, a lead frame, and multiple semiconductor chips, all sealed to ensure optimal functionality.

Career Highlights

Byoung-ok Lee is currently employed at Fairchild Korea Semiconductor Ltd., where he continues to innovate in the field of semiconductor technology. His work has significantly impacted the development of power device packages, making them more efficient and reliable.

Collaborations

Throughout his career, Byoung-ok Lee has collaborated with talented individuals such as O-seob Jeon and Joon-seo Son. These collaborations have fostered a creative environment that has led to groundbreaking advancements in power device technology.

Conclusion

Byoung-ok Lee's contributions to power device packaging demonstrate his commitment to innovation and excellence in the semiconductor industry. His patents reflect a deep understanding of the challenges faced in this field and provide effective solutions that enhance device performance.

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