The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Oct. 26, 2004
Gi-young Jeun, Kyungki-do, KR;
Sung-min Park, Seoul, KR;
Joo-sang Lee, Seoul, KR;
Sung-won Lim, Kyungki-do, KR;
O-seob Jeon, Seoul, KR;
Byoung-ok Lee, Kyungki-do, KR;
Young-gil Kim, Seoul, KR;
Gwi-gyeon Yang, Kyungki-do, KR;
Gi-young Jeun, Kyungki-do, KR;
Sung-min Park, Seoul, KR;
Joo-sang Lee, Seoul, KR;
Sung-won Lim, Kyungki-do, KR;
O-seob Jeon, Seoul, KR;
Byoung-ok Lee, Kyungki-do, KR;
Young-gil Kim, Seoul, KR;
Gwi-gyeon Yang, Kyungki-do, KR;
Abstract
A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.