Gwi-gyeon Yang

Title: Gwi-gyeon Yang: Innovator in Semiconductor Technology

Introduction

Gwi-gyeon Yang is a prominent inventor based in Icheon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on complex semiconductor packages and power device packages, showcasing his expertise in innovative manufacturing methods.

Latest Patents

Yang's latest patents include groundbreaking advancements in semiconductor packaging. One of his notable inventions is a complex semiconductor package that integrates a large power module with a small semiconductor package. This invention outlines methods for fabricating these complex packages, which include a first package with a packaging substrate and multiple semiconductor chips, all sealed within a protective member. Another significant patent is for a power device package that allows for compact design by vertically stacking substrates with mounted semiconductor chips. This innovation includes a lead frame and a sealing member that ensures the integrity of the device while exposing essential surfaces for functionality.

Career Highlights

Throughout his career, Gwi-gyeon Yang has worked with Fairchild Korea Semiconductor Ltd. and Fairchild Korea. His experience in these companies has allowed him to develop and refine his skills in semiconductor technology, contributing to the advancement of the industry.

Collaborations

Yang has collaborated with notable colleagues such as Gi-young Jeun and Sung-Min Park. Their teamwork has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the semiconductor field.

Conclusion

Gwi-gyeon Yang's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in complex semiconductor packaging and power device solutions.