Okazaki, Japan

Kento Asaoka

This inventor holds 3 USPTO granted patents and 3 EPO patents. Top assignee: Fuji Corporation. Active years: 2019-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kento Asaoka. Retrieved from https://idiyas.com/inventor/kento-asaoka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Nishio, JP (2019)
  • Okazaki, JP (2020 - 2021)

Company Filing History:


Years Active: 2019-2021

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3 patents (USPTO):Explore Patents

Title: Kento Asaoka: Innovator in Solder Paste Printing Technology

Introduction

Kento Asaoka is a notable inventor based in Okazaki, Japan. He has made significant contributions to the field of solder paste printing technology. With a total of 3 patents to his name, Asaoka's work focuses on improving the efficiency and accuracy of solder paste application in electronic manufacturing.

Latest Patents

Asaoka's latest patents include a printing device and printing method designed for solder paste printers. This innovative device features a squeegee that applies a smaller pressing force towards the stencil when spreading solder paste compared to the printing pressure used during the actual printing process. The design allows the solder paste to spread along the squeegee rather than being pressed down, enhancing the overall printing quality. Additionally, the squeegee moves faster when spreading solder paste than when printing, ensuring that the paste is adequately distributed before being pressed down.

Another significant patent is the viscous fluid supply device, which utilizes a positive and negative pressure supply mechanism to control the movement of the solder cup within the printer. This device allows for precise control over the supply of solder paste from the nozzle. The controller measures the time taken to decrease the pressure in the air chamber, which corresponds to the movement of the solder cup. This feature enables accurate estimation of the remaining solder paste, improving operational efficiency.

Career Highlights

Kento Asaoka is currently employed at Fuji Corporation, where he continues to develop innovative solutions in the field of solder printing technology. His work has been instrumental in advancing the capabilities of solder paste printers, making them more efficient and reliable.

Collaborations

Asaoka collaborates with talented colleagues, including Shoji Fukakusa and Ritsuo Hirukawa. Their combined expertise contributes to the innovative environment at Fuji Corporation, fostering the development of cutting-edge technologies.

Conclusion

Kento Asaoka is a prominent inventor whose work in solder paste printing technology has led to significant advancements in the industry. His innovative patents reflect his commitment to improving manufacturing processes, making him a valuable asset to Fuji Corporation and the field of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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