The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Feb. 27, 2014
Fuji Corporation, Chiryu, JP;
FUJI CORPORATION, Chiryu, JP;
Abstract
A solder supply device is provided with solder cup housing liquid solder that is tubular and open at one end, a positive/negative pressure supply device capable of controlling the pressure inside the solder cup, a supply nozzle for dispensing solder from the solder cup, and a solder cutting device that cuts solder supplied from the supply nozzle by ejecting compressed air. Solder is supplied from the supply nozzle by increasing the pressure inside the solder cup using the positive/negative pressure supply device. When stopping the supply of solder from the supply nozzle, the pressure inside the solder cup is decreased using the positive/negative pressure supply device, and solder is cut by the solder cutting device to match the timing of pressure inside the solder cup decreasing.