Fuji Corporation

Kento Asaoka

Shoji Fukakusa

Ritsuo Hirukawa

Minoru Kinuta

Takenobu Kato

A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.

Printing device and printing method

In solder printer, solder supply device uses positive and negative pressure supply device to apply pressure inside air chamber to move solder cup inside outer tube, such that solder paste is supplied from supply nozzle. Controller, when supply of solder paste from supply nozzle is stopped, performs drive control of positive and negative pressure supply device to decrease the pressure inside air chamber, and uses timer to measure the time required from the starting of decreasing the pressure inside the air chamber to when the pressure inside air chamber has reached a set pressure. Because this required time corresponds to the movement amount of solder cup from the start of supply of the solder paste to when supply is stopped, controller using the measured required to estimate the remaining amount of the solder paste in detail with good accuracy.

Viscous fluid supply device

A solder supply device is provided with solder cup housing liquid solder that is tubular and open at one end, a positive/negative pressure supply device capable of controlling the pressure inside the solder cup, a supply nozzle for dispensing solder from the solder cup, and a solder cutting device that cuts solder supplied from the supply nozzle by ejecting compressed air. Solder is supplied from the supply nozzle by increasing the pressure inside the solder cup using the positive/negative pressure supply device. When stopping the supply of solder from the supply nozzle, the pressure inside the solder cup is decreased using the positive/negative pressure supply device, and solder is cut by the solder cutting device to match the timing of pressure inside the solder cup decreasing.

Growing community of inventors

Okazaki, Japan

Kento Asaoka