The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Jun. 17, 2016
Applicant:

Fuji Corporation, Chiryu, JP;

Inventors:

Minoru Kinuta, Chiryu, JP;

Shoji Fukakusa, Yokkaichi, JP;

Kento Asaoka, Okazaki, JP;

Assignee:

FUJI CORPORATION, Chiryu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41F 15/46 (2006.01); B41M 1/12 (2006.01); B41F 15/08 (2006.01); B41F 15/42 (2006.01); H05K 3/12 (2006.01); B41M 3/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B41F 15/46 (2013.01); B41F 15/0881 (2013.01); B41F 15/423 (2013.01); B41M 1/12 (2013.01); B41M 3/006 (2013.01); H05K 3/1225 (2013.01); H05K 3/1233 (2013.01); H05K 3/3485 (2020.08); H05K 2203/0139 (2013.01);
Abstract

A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.


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