This inventor holds 23 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Sharp Kabushiki Kaisha Corporation, Sharp Kabushiki Kaishi. Active years: 1995-2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Ikoma, JP (1995 - 2009)
- Fukuyama, JP (2009 - 2010)
- Osaka, JP (2013)
Company Filing History:
22 out of 25,954 
1 out of 22 Years Active: 1995-2013
Areas of Expertise:
Title: **Kenji Toyosawa: A Pioneer in Semiconductor Innovations**
Introduction
Kenji Toyosawa is an accomplished inventor based in Ikoma, Japan, with an impressive portfolio of 23 patents to his name. His expertise in the semiconductor industry has led to significant advancements in semiconductor apparatus and packaging technologies, positioning him as a key figure in this dynamic field.
Latest Patents
Among Toyosawa's latest innovations are two notable patents that address crucial aspects of semiconductor packaging. The first is a "Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure." This invention focuses on a TAB tape packaging structure that offers enhanced protection for semiconductor chips during shipping and transportation. The design incorporates an embossed tape with electroconductive features that securely wraps the TAB tape, ensuring effective and efficient packaging.
The second patent, titled "Sealed-by-resin type semiconductor device," outlines a semiconductor device configuration that uses a sealing resin to protect the semiconductor chip mounted on a flexible wiring substrate. This setup allows for increased durability and reliability, features essential in modern electronic devices.
Career Highlights
Kenji Toyosawa's career spans significant contributions to renowned companies, including Sharp Corporation. His work at Sharp has involved collaborations on innovative technologies that have propelled advancements in the semiconductor field. His dedicated research and inventive mindset have led to the successful development and filing of multiple patents.
Collaborations
Throughout his career, Toyosawa has collaborated with skilled professionals, such as Atsushi Ono and Yasunori Chikawa. Their teamwork has fueled breakthroughs in semiconductor technology and has contributed to a deeper understanding of complex packaging methods.
Conclusion
Kenji Toyosawa's contributions to semiconductor technology are invaluable. His continuous innovations not only reflect his expertise but also highlight the ongoing advancements in the industry. With a total of 23 patents, Toyosawa solidifies his legacy as a pioneer of semiconductor apparatus, making a significant impact on future technological developments.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile