The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2009
Filed:
May. 20, 2005
Applicants:
Kazuhiko Fukuta, Fukuyama, JP;
Kenji Toyosawa, Fukuyama, JP;
Takashi Kidoguchi, Nara, JP;
Inventors:
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A high reliability semiconductor device is provided which can prevent electromigration due to the deposition of metal ions originating from wires. The device includes: a flexible wiring boardincluding a base filmand multiple wires; a semiconductor chipmounted to the flexible wiring board; and a sealing resindisposed between the flexible wiring boardand the semiconductor chipso as to at least partially in contact with the wires. The sealing resincontains a metal ion binder mixed thereto.