The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2009
Filed:
Sep. 06, 2007
Toshiharu Seko, Yamatokoriyama, JP;
Kenji Toyosawa, Ikoma, JP;
Toshiharu Seko, Yamatokoriyama, JP;
Kenji Toyosawa, Ikoma, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
The present invention provides a semiconductor device tape carrier formed of an insulative tapeof a thin film, which becomes a semiconductor device by conducting a plurality of wire patternson its surface to a bumpof a semiconductor elementand being sealed by an insulative resin, wherein: an outer dimension of the semiconductor device in a carriage direction of the insulative tapeis greater than an integral multiple X (X=1, 2, 3, 4, 5, . . . ) of a pitch interval of sprocket holes, which are openings formed to carry the insulative tape, and not more than: the integral multiple X+a decimal Y (0<Y<1), and the tape pitch for a single semiconductor device is set to the integral multiple X+a decimal Y (0<Y<1). In this way, the manufacturing method for semiconductor device, the semiconductor device, and the semiconductor module device for a tape carrier type semiconductor device according to the present invention reduces an unformed region of the insulative tapewhich is irrelevant to the outer dimension of the semiconductor device.