The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Dec. 05, 2003
Applicant:
Kenji Toyosawa, Ikoma, JP;
Inventor:
Kenji Toyosawa, Ikoma, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor device of the present invention has two inner inner leads to be bonded with inner-side bump electrodes each placed at a position which is a relatively large distance apart from the edge of a semiconductor chip, between outer-side bump electrodes each placed at a position which is a relatively small distance apart from the edge of the semiconductor chip. At least one of the inner inner leads is bent in accordance with a bonding position with the inner-side bump electrode.