The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Nov. 07, 2008
Satoru Kudose, Osaka, JP;
Kenji Toyosawa, Osaka, JP;
Satoru Kudose, Osaka, JP;
Kenji Toyosawa, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A TAB tape () packaging structure in which (i) the TAB tape () including a plurality of semiconductor chips () which are fixed, on a film () on which wiring patterns are repeatedly provided and (ii) an embossed tape () which is electroconductive and has embossed parts () which are sequentially provided on a first surface of and in a longitudinal direction of a film () are wound on a reel which is electroconductive is arranged such that the TAB tape () and the embossed tape () are wound on the reel, while (i) a first surface of the film () on which surface the plurality of semiconductor chips () are fixed and (ii) the first surface of the film () on which surface the embossed parts () protrude are overlapping and facing each other, and the embossed tape () has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips () has a thickness of t (0.2≦t≦0.625) mm and the film () has a substantial thickness of 0.125 mm. This realizes packaging of a TAB tape in a desired winding length while sufficiently securing protection of the TAB tape during shipping and transportation.