Nisshin, Japan

Kenji Kita


Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 21(Granted Patents)


Location History:

  • Nisshin, JP (2009 - 2013)
  • Tokyo, JP (2014)

Company Filing History:


Years Active: 2009-2014

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4 patents (USPTO):

Title: **Kenji Kita: Innovator in Wafer Adhesive Technology**

Introduction: Kenji Kita, an accomplished inventor based in Nisshin, Japan, has made significant contributions to the field of adhesive technologies, particularly concerning wafer adherence. With a total of four patents to his name, his innovative designs are pivotal in advancing the efficiency of wafer processing in various industries.

Latest Patents: Among his notable patents, the "Wafer-adhering adhesive tape" stands out. This inventive tape features a radiation-curable removable adhesive layer primarily composed of an acrylic-series copolymer. This copolymer possesses at least one radiation-curable carbon-carbon double bond, a hydroxyl group, and a carboxyl group in its principal chain, with a gel fraction of 60% or greater. Another significant patent is the "Wafer-processing tape and method of producing the same." This invention highlights a dual-layer adhesive system where the adhesive and removable layers perform differently based on specific bond conditions, ensuring controlled transfer during application and removal processes.

Career Highlights: Kenji has collaborated with prestigious companies such as the Furukawa Electric Co., Ltd. and Hitachi Chemical Company, Ltd., where he honed his skills and applied his inventive ideas. His work has been crucial in refining adhesive systems that are integral to semiconductor processing.

Collaborations: Throughout his career, Kenji Kita has worked alongside prominent professionals such as Yasumasa Morishima and Shinichi Ishiwata. Their collaboration has contributed significantly to the innovation of adhesive technologies in the semiconductor sector, leading to enhanced manufacturing processes and product quality.

Conclusion: Kenji Kita remains a notable figure in the field of adhesive innovation, continuously pushing the boundaries of technology with his patents. His inventions reflect a deep understanding of material science, paving the way for future advancements in wafer processing and adhesive applications.

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