The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Mar. 15, 2005
Keiichi Hatakeyama, Tsukuba, JP;
Michio Uruno, Ichihara, JP;
Takayuki Matsuzaki, Ichihara, JP;
Yasumasa Morishima, Yokohama, JP;
Kenji Kita, Nisshin, JP;
Shinichi Ishiwata, Isehara, JP;
Keiichi Hatakeyama, Tsukuba, JP;
Michio Uruno, Ichihara, JP;
Takayuki Matsuzaki, Ichihara, JP;
Yasumasa Morishima, Yokohama, JP;
Kenji Kita, Nisshin, JP;
Shinichi Ishiwata, Isehara, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).