The Furukawa Electric Co., Ltd.

Hitachi Chemical Company, Ltd.

Kenji Kita

Shinichi Ishiwata

Yasumasa Morishima

Takayuki Matsuzaki

Michio Uruno

Keiichi Hatakeyama

Takanori Yamakawa

A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.

Wafer-adhering adhesive tape

A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B&#x3e;A, and an area where A&#x3e;B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B&#x3e;A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A&#x3e;B during peeling off the tape.

Wafer-processing tape and method of producing the same

A wafer-processing tape, having a removable adhesive layer (), and an adhesive layer (), formed on a substrate film (), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate () having convex-type metal electrodes (), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer () is peeled from the substrate film () but is bonded to the individual chip.

Method of producing a semiconductor device, and wafer-processing tape

The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

Growing community of inventors

Nisshin, Japan

Kenji Kita