The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Mar. 09, 2006
Kenji Kita, Nisshin, JP;
Yasumasa Morishima, Tokyo, JP;
Shinichi Ishiwata, Tokyo, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B>A, and an area where A>B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A>B during peeling off the tape.