The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Jan. 31, 2007
Yasumasa Morishima, Tokyo, JP;
Kenji Kita, Nisshin, JP;
Shinichi Ishiwata, Tokyo, JP;
Takanori Yamakawa, Tokyo, JP;
Yasumasa Morishima, Tokyo, JP;
Kenji Kita, Nisshin, JP;
Shinichi Ishiwata, Tokyo, JP;
Takanori Yamakawa, Tokyo, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A wafer-processing tape, having a removable adhesive layer (), and an adhesive layer (), formed on a substrate film (), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate () having convex-type metal electrodes (), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer () is peeled from the substrate film () but is bonded to the individual chip.