Kenichiro Iwakiri is a prominent inventor based in Ageo, Japan, known for his significant contributions to the field of copper foil technology. With a total of seven patents to his name, Iwakiri has made remarkable advancements that enhance the performance and reliability of copper foils used in various applications.

Latest Patents

Iwakiri's latest patents include an innovative electrodeposited copper foil with a carrier foil that features a primer resin layer. This invention addresses the challenge of ensuring high bonding strength between the bulk copper layer and the resin substrate layer, even when the surface roughness is low. The design minimizes the risk of delamination, even in the presence of pinholes after exposure to desmear solutions. Another notable patent focuses on a method for manufacturing copper foil characterized by high adhesion, even with low roughness on the nodular surface. This patent outlines a specific relationship between the area coefficient and roughness of the copper foil, ensuring optimal performance.

Career Highlights

Iwakiri is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to develop cutting-edge technologies in the field of materials science. His work has significantly impacted the industry, leading to improved manufacturing processes and product quality.

Collaborations

Iwakiri collaborates with esteemed colleagues such as Takashi Kataoka and Yutaka Hirasawa, contributing to a dynamic research environment that fosters innovation and creativity.

Conclusion

Kenichiro Iwakiri's contributions to copper foil technology exemplify the spirit of innovation and dedication to advancing materials science. His patents not only enhance product performance but also pave the way for future developments in the industry.

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