Mitsui Minings & Melting Co., Ltd.

Kenichiro Iwakiri

Yutaka Hirasawa

Takuya Yamamoto

Takashi Kataoka

Tetsuro Sato

Junshi Yoshioka

Shinichi Obata

Makoto Dobashi

Toshifumi Matsushima

Akiko Sugimoto

Tsutomu Asai

Tetsuhiro Matsunaga

Seiji Nagatani

Tsutomu Higuchi

Akiko Sugioka

Kensuke Nakamura

Akitoshi Takanashi

Hiroyuki Kon

Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni&#x2014;Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof

The object is to provide copper foil of high adhesion even when the roughness Rof a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness R(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness R(S) is 1.0 &#x3bc;m to 3.0 &#x3bc;m,0.5&#xd7;()+0.5&#x2266;()&#x2003;&#x2003;(1)where R(S) is a numerical value represented by &#x3bc;m.

Copper foil and method of manufacturing the same

The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200&#xb0;C. For this purpose are adopted 'a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed' and others.

Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method

The invention provides a resin-coated composite foil characterized in that an organic insulating layer is disposed on an ultra-thin copper foil is disposed on a supporting metal layer through an intermediate organic release layer. The resin-coated composite foil is free from the peeling or blistering between the supporting metal foil and the ultra-thin copper foil during the production of a copper clad laminate.

Resin-coated composite foil, production and use thereof

A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.

Composite material used in making printed wiring boards

This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer, preferably by electrodeposition. The organic release layer preferably is a heterocyclic compound selected from triazoles, thiazoles, imidazoles, or their derivatives, and provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

Making and using an ultra-thin copper foil

This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer by electrodeposition. The organic release layer preferably is a nitrogen-containing compound, a sulfur-containing compound, or a carboxylic acid, which provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

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Ageo, Japan

Kenichiro Iwakiri