The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2007
Filed:
May. 12, 2003
Akitoshi Takanashi, Ageo, JP;
Kenichiro Iwakiri, Ageo, JP;
Akiko Sugimoto, Ageo, JP;
Junshi Yoshioka, Ageo, JP;
Shinichi Obata, Ageo, JP;
Makoto Dobashi, Ageo, JP;
Akitoshi Takanashi, Ageo, JP;
Kenichiro Iwakiri, Ageo, JP;
Akiko Sugimoto, Ageo, JP;
Junshi Yoshioka, Ageo, JP;
Shinichi Obata, Ageo, JP;
Makoto Dobashi, Ageo, JP;
Mitsui Mining & Smelting Co., Ltd., Shinagawa-ku, Tokyo, JP;
Abstract
The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose are adopted 'a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed' and others.