Akitoshi Takanashi

Title: Akitoshi Takanashi: Innovator in Printed Wiring Board Manufacturing

Introduction

Akitoshi Takanashi is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of printed wiring board manufacturing. With a total of 3 patents to his name, Takanashi has developed innovative methods that enhance the efficiency and quality of circuit formation.

Latest Patents

Takanashi's latest patents focus on methods for manufacturing printed wiring boards that effectively suppress pattern failure while maintaining excellent fine circuit forming properties. One of his methods involves providing an insulating substrate with a roughened surface and performing electroless plating to create a layer that is less than 1.0 μm thick. This layer features specific surface characteristics, including an arithmetic mean waviness and a valley portion void volume, which are crucial for the quality of the final product. The process continues with laminating a photoresist, exposure and development to form a resist pattern, electroplating, stripping the resist pattern, and etching away unnecessary portions to create a wiring pattern.

Career Highlights

Takanashi is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate in the field of electronics manufacturing. His work has been instrumental in advancing the technology used in printed wiring boards, which are essential components in various electronic devices.

Collaborations

Throughout his career, Takanashi has collaborated with talented individuals such as Yoshinori Shimizu and Hiroto Iida. These collaborations have contributed to the development of cutting-edge technologies in the industry.

Conclusion

Akitoshi Takanashi's contributions to printed wiring board manufacturing demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in circuit formation, making him a valuable asset to the field.