The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Sep. 09, 2005
Tetsuhiro Matsunaga, Ageo, JP;
Toshifumi Matsushima, Ageo, JP;
Tetsuro Sato, Ageo, JP;
Kensuke Nakamura, Ageo, JP;
Hiroyuki Kon, Ageo, JP;
Kenichiro Iwakiri, Ageo, JP;
Tetsuhiro Matsunaga, Ageo, JP;
Toshifumi Matsushima, Ageo, JP;
Tetsuro Sato, Ageo, JP;
Kensuke Nakamura, Ageo, JP;
Hiroyuki Kon, Ageo, JP;
Kenichiro Iwakiri, Ageo, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.