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Kensuke Nakamura

This inventor holds 4 USPTO granted patents. Top assignee: Mitsui Minings & Melting Co., Ltd.. Active years: 2009-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kensuke Nakamura. Retrieved from https://idiyas.com/inventor/kensuke-nakamura-3coq6nb8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4

% Patents Active = 25.0

Average Co-Inventor Count = 1.8

ph-index = 1

Forward Citations = 4(Granted Patents)

Company Filing History:

Mitsui Minings & Melting Co., Ltd.

Years Active: 2009-2012

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8304091 - Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof (2012-11-06),

2. 8205329 - Method for manufacturing dielectric layer constituting material, dielectric layer constituting material obtained thereby; method for manufacturing capacitor circuit forming piece using dielectric layer constituting material, capacitor circuit forming piece obtained thereby; and multi-layer printed wiring board obtained by using dielectric layer constituting material and/or capacitor circuit forming piece (2012-06-26),

3. 8062539 - Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the same (2011-11-22),

4. 7485361 - Multilayered printed wiring board and manufacturing method thereof (2009-02-03),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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